An executive panel moderated by Ed Sperling of Semiconductor Engineering on how agentic AI is changing chip design and verification, with panelists from Breker, ChipAgents, Moores Lab AI, Silimate, Silvaco, and Verific. It left us thinking about how teams will audit what agentic systems produce.
Hot Chips has been our favorite industry show to attend these last few years. The bleeding edge shows up here first: the people who built the silicon walk through it themselves, a full cycle before it reaches the rest of the industry.
Hoover Tower from the auditorium window, Hot Chips 2025.